• Contents
  • Index
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  • Introduction
  • Release notes and licence
  • Examples
    • Aerospace/Military
    • PEDs
    • Marine/Naval
    • Vehicles/Automotive
    • RAKE
    • Industrial and Power
    • Domestic: emissions
    • Domestic: susceptibility
    • Medical
    • Rail Transport
    • Lighting
    • Broadcast transmitters
    • Circuit techniques
  • Interference basics
    • RF emissions
    • LF emissions
    • RF and AF susceptibility
    • Transient susceptibility
    • Principles
      • Disturbance sources
      • Common versus differential mode
      • Transmission line behaviour
    • Coupling mechanisms
      • Common impedance coupling
      • Near field coupling
      • Far field coupling
      • Accidental antenna coupling
      • Reciprocity
  • Product design techniques
    • Enclosure shielding
      • Shielding theory
      • Control of apertures
      • Conductive coatings and windows
      • Partitioning and zoning
      • Grounding and bonding
      • Heatsinks and EMC
    • PCB layout
      • Signal/return proximity
      • Power and Ground planes
      • The layer stack
      • Layout
      • Board level shielding
      • Connecting PCB and chassis
    • Cables
      • Unshielded cables
      • Screened cable connectors
      • Cable shielding
      • Cable ferrites
      • Cable routing and segregation
    • Filters and interfaces
      • Filter components
      • Filter assembly
      • Power interface filtering
      • Signal interface filtering
      • Balanced interfaces
      • Isolated interfaces
      • Transient protection
    • Circuit design
      • Power switching circuit design
        • Switching emissions coupling paths
        • Variable speed motor drives
        • AC supply harmonics
      • Decoupling
      • Digital clocks
      • Transmission lines and ringing
      • Digital immunity
      • Analogue immunity
      • Switches and motors
  • Standards Compliance
    • CISPR emissions
    • IEC immunity
    • DEF STAN 59-411
    • MIL STD 461
    • EV standards
    • Standards update
  • Benchtop tests and troubleshooting
    • Pitfalls of EMC tests
    • Equipment & Budgeting
    • Pre-compliance tests basics
    • Conducted emission test
    • Radiated emission test
    • Conducted Immunity test
    • Radiated Immunity test
    • Electric Fast Transient (EFT)
    • Electrostatic Discharge (ESD) Test
    • RF current probes
    • Near-field probes
  • FAQs
  • Glossary
  • Questions
    • Coupling
    • Transients
    • Unscreened cables
    • Screened cables
    • Filters
    • PCB layout
    • Shielding and grounding
    • Transmission lines
    • Circuit design
  • 10·h rule
  • 360° screen termination
  • Air gap breakdown
  • Antenna
  • Arcing
  • Audio rectification
  • Automotive standards
  • Average detector
  • Balance
  • Bandwidths
    • measurement
  • Biot-Savart law
  • Bonding
  • Cable
    • Classes
    • Connectors
    • Ferrite choke
    • Flexi
    • Ribbon
    • Routing
    • Screen termination
    • Separation
    • Twisted pair
  • Characteristic impedance
  • CISPR emissions standards
  • Clamping
  • Class A/B Limit
  • Clock buffering
  • Common impedance
  • Common mode
    • choke
    • rejection
  • Conducted tests
    • DEF STAN 59-411
    • IEC immunity
    • MIL STD 461
    • RF emissions
  • Conductive coatings
  • Conductive gaskets
  • Conformity assessment
  • Connectors
  • Contact suppression
  • Decoupling
  • DEF STAN 59-411
  • Detectors
  • Differential mode
  • Differential pair
  • Digital clocks
  • Dynamic noise immunity
  • EFT Burst
  • Electric screening
  • Electrochemical compatibility
  • Electromagnetic environment
  • Electrostatic discharge
  • Emissions limits (RF)
  • Enclosure shielding
  • Ethernet
  • Far field
  • Faraday's law
  • Fast transients
  • FCC emissions
  • Feedthrough capacitor
  • Ferrite
    • cable sleeve choke
    • Surface mount chip impeder
  • Filter components
  • Finger strip
  • Flexi cable
  • Flicker
  • Fourier Transform
  • Frequency domain
  • GDT
  • Gridded ground
  • Ground bounce
  • Ground loops
  • Ground plane
  • Grounding contacts
  • Harmonics
    • mains supply current
  • Heatsinks
  • IEC 61000-3-2
  • IEC 61000-4-x
  • IEC 61000-5-2
  • Immunity
    • Analogue
    • digital
    • standards
  • Inrush current
  • ISO 7637
  • Isolation
  • Leakage flux
  • Leakage inductance
  • LISN
  • Load dump
  • Longitudinal Conversion Loss
  • Loop inductance
  • Magnetic field immunity
  • Magnetic screening
  • Mains filter
  • Mains harmonics
  • Matching
  • Maxwell’s equations
  • MIL STD 461
  • Motor noise
  • MOV
  • mu-metal
  • Mutual inductance
  • Near field
  • Op-amp
  • Optical fibre
  • Opto-coupler
  • Oscillatory transients
  • Parallel earth conductor (PEC)
  • Patch antenna
  • PCB
    • layer stack
    • planes
    • shielding
    • track impedance
  • Peak detector
  • Performance criteria
  • Phase control
  • Pigtail
  • Plane wave
  • Port
  • Power factor
  • Power plane
  • Power supply variations
  • Quasi-peak detector
  • Radiated tests
    • DEF STAN 59-411
    • IEC 61000-4-3
    • MIL STD 461
  • Rayleigh range
  • Reflection coefficient
  • Reset inputs
  • Resonance
    • in components
    • in enclosures
    • on PCBs
  • Resonant frequency
  • Reverse recovery (diode)
  • RF emissions
  • Ribbon cable
  • Ring wave
  • Ringing
  • Safety ratings
  • Self resonance
  • Shielding
    • coatings
    • on the PCB
    • windows
  • Showering arc
  • Skin effect
  • Snubber
  • Software
  • Spread spectrum clocking
  • Surge
  • Susceptibility
  • Switching converter
  • Switching transients
    • Protection
    • Suppression
  • Test plan
  • Three-terminal capacitor
  • Timing skew
  • Totem-pole current
  • Transfer impedance
  • Transient energy
  • Transition region
  • Transmission line
  • Trapezoidal wave
  • TVS
  • Twisted pair
  • Variable speed drives
  • Watchdog
  • Wave impedance
  • Waveguide below cutoff
  • WEEE
  • Windows
  • Wire impedance
  • X capacitor
  • X2Y capacitor
  • Y capacitor
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